반도체 세라믹 부품

Ceramic components used in semiconductor equipment need a specification tied to their location and function. An insulating support outside a chamber and a component exposed to the process environment do not have the same requirements. Identify the installation position before choosing a material or surface condition.

Describe the component’s role

Provide a drawing showing locating faces, holes, contact areas and any interfaces with metal or other ceramics. State whether the part supports, positions or electrically separates another component. For a replacement, include the equipment-part reference that you are authorised to share.

Separate geometry from process requirements

• Material grade or composition limits required by the equipment specification.
• Temperature, vacuum level and process-media exposure where applicable.
• Surface finish, edge condition and critical geometric relationships.
• Cleaning, particle-control and packaging requirements with defined acceptance methods.
• Any requested material, dimensional or application-specific test records.

Describe plasma, chemical or vacuum exposure explicitly rather than relying on the phrase “semiconductor grade.” These conditions require a specific material and validation review; a general ceramic description is not evidence of process compatibility.

Prepare the review package

Send the drawing revision, quantity and required documentation. Identify which criteria are mandatory and which can be discussed during evaluation. Read the equipment-part selection guide 또는 contact NORKE to discuss the component.

• Part definition: drawing, installation position, function and critical interfaces.
• Process requirements: specified material, exposure, cleanliness and surface condition.
• Acceptance: agreed test methods, documentation and sample evaluation scope.